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電阻型錄 > 零阻抗跳線 > JP 系列
JP 系列
ZERO-OHM JUMPER WIRE

DIMENSIONS(mm) in

L D H d
1/8W 3.7±0.4 1.5±0.2 27MIN 0.5±0.02
1/4W 6.5±0.5 2.3±0.2 27MIN 0.6±0.02

PACKING: Resistors supplied on reels of 5,000 pieces per EIA RS-296-C

DIMENSIONS(mm.) In
E. 530.5.....................
F. 6.6±0.5..................
P1.5.08±0.4...............
Pn.500±4..................
n:100 spacings
L. 6.35±0.25..............
2.090±.020
2.600±.020
200±.015
19.685±.157

250±.010
TEST TEST METHOD LIMITS
RESISTANCE <0.005 ohm
OPERATING TEMPERATURE -55℃ to +155℃
MAX. CURRENT 5. amps
MAX. WORKING VOLTAGE 300Vdc
MAX. OVERLOAD VOLTAGE 600Vdc
TEMPERATURE COEFFICIENT (PPM/℃) 0 to - 100 PPM
SHORT TIME OVERLOAD Apply 2.5 times the voltage rating for 5 sec NO VISIBLE DAMAGE
LOAD LIFE 1,000 hrs. at 70℃ a direct voltage applied, cycles of 1.5 hrs. on
and 0.5 hrs. off throughout test
△ R = 0.5%
TEMPERATURE CYCLING 5 cycles of 30 min. duration at the extremes of temp range,
maximum and minimum, measurement of ohmic valure 4 hrs.
after completion of test

△ R = 0.5%

DIELECTRIC STRENGTH Using a 90°"V" shaped conductive block apply 100V minimum,
Increasing 100V/sec. For 5 sec.
△ R = 0.5%
HUMIDITY 350 hrs. at 40℃,90to 95% Rh △ R = 0.5%
SOLDERABILITY Dipped in Sn / Pb (60/40)at 235°,5sce. 1.5mm from the body 95% OF TESTED SURFACE
COVERED
VIBRATION By Mil STD.202,201A
TERMINAL ROBUSTNESS Traction, applied 2.5kg.for 10 sec. Bends,2 bends 90℃applying
Load to terminals of 0.5kg. Twist, 2 successive turns 180°, 6mm
From body

NO VISIBLE DAMAGE

RESISTANCE TO SOLVENTS Trichlorethylene , TMC as the most aggressives for 60 sec. At
Boiling point.
NO VISIBLE DAMAGE
APPLICATIONS
Molded jumper wires or crossovers, as they are sometimes called, are basically interconnection devices between points on a PC board.

Generally they are used for the following reasons:
  • Inability to connect two points on a PC board due to other circuit paths which must be crossed over.
  • An after-the-fact design change that requires new point connections.
  • Circuit tuning by changing point connections.
  • Optional feature applications.
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